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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 1 one world one brand one strategy one focus one team one kemet benefts ? higher capacitance in the same footprint ? potential board space savings. ? advanced protection against thermal and mechanical stress ? provides up to 10mm of board fex capability ? reduces audible, microphonic noise ? extremely low esr and esl ? pb-free and rohs compliant ? capable of pb-free refow profles ? non-polar device, minimizing installation concerns ? automotive grade (aec-q200) under development. applications ? industrial, automotive, military, telecom ? smoothing circuits ? dc-to-dc converters ? power supplies (input/output flters) ? noise reduction (piezoelectric / mechanical) ? circuits with a direct battery or power source connection. ? critical and safety relevant circuits without (integrated) current limitation. ? any application that is subject to high levels of board fexure or temperature cycling overview kemets kps series ( k emet p ower s olutions) utilizes proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors (mlccs) into a single compact surface mount package. the attached lead-frame mechanically isolates the capacitor/s from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. a two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount mlcc devices. providing up to 10mm of board fex capability, kps series capacitors are environmentally friendly and in compliance with rohs legislation. available in x7r dielectric, these devices are capable of pb-free refow profles and provide lower esr, esl and higher ripple current capability when compared to other dielectric solutions. surface mount multilayer ceramic chip capacitors kps series C commercial grade (x7r dielectric) 1 double chip stacks ("2" in the 13th character position of the ordering code) are only available in m (20%) capacitance tolerance. single chip stacks ("1" in the 13th character position of the ordering code) are available in k (10%) or m (20%) tolerances. 2 additional termination options may be available. contact kemet for details. 3 additional reeling or packaging options may be available. contact kemet for details. ordering information c 2220 c 106 m 5 r 2 c tu ceramic case size (l" x w") specifcation/ series capacitance code (pf) capacitance tolerance 1 voltage dielectric failure rate/design end metallization 2 packaging/grade (c-spec) 3 1210 1812 2220 c = standard 2 sig. digits + number of zeros k = 10% m = 20% 8 = 10v 4 = 16v 3 = 25v 5 = 50v 1 = 100v a = 250v r = x7r 1 = kps single chip stack 2 = kps double chip stack c = 100% matte sn tu = 7" reel unmarked 7289 = 13" reel unmarked
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 2 2 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) dimensions C millimeters (inches) outline drawing qualifcation/certifcation commercial grade products meet or exceed the performance and reliability standards outlined in table 4 - performance and reliability of this specifcation. environmental compliance rohs prc ( peoples republic of china) compliant electrical parameters/characteristics to obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. capacitance and dissipation factor (df) measured under the following conditions: 1khz 50hz and 1.0 0.2 vrms if capacitance 10f 120hz 10hz and 0.5 0.1 vrms if capacitance >10f chip stack eia size code metric size code l length w width t thickness lw lead width mounting technique single 1210 3225 3.50 (.138) 0.30 (.012) 2.60 (.102) 0.30 (.012) 3.35 (.132) 0.10 (.004) 0.80 (.032) 0.15 (.006) solder refow 1812 4532 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.50 (.020) 2.65 (.104) 0.35 (.014) 1.10 (.043) 0.30 (.012) 2220 5650 6.00 (.236) 0.50 (.020) 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.30 (.012) 1.60 (.063) 0.30 (.012) double 1210 3225 3.50 (.138) 0.30 (.012) 2.60 (.102) 0.30 (.012) 6.15 (.242) 0.15 (.006) 0.80 (.031) 0.15 (.006) 1812 4532 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.50 (.020) 5.00 (.197) 0.50 (.020) 1.10 (.043) 0.30 (.012) 2220 5650 6.00 (.236) 0.50 (.020) 5.00 (.197) 0.50 (.020) 5.00 (.197) 0.50 (.020) 1.60 (.063) 0.30 (.012) operating temperature range: -55c to +125c capacitance change with reference to +25c and 0 vdc applied (tcc): 15% aging rate (max % cap loss/decade hour): 3.5% dielectric withstanding voltage: 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50ma) dissipation factor (df) maximum limits @ 25oc: 5% (10v), 3.5% (16v & 25v) and 2.5% (50v to 200v) insulation resistance (ir) limit @ 25c: see insulation resistance limit table page 3 top view profle view single or double double chip stack single chip stack chip stack ref name material a leadframe phosphor bronze - alloy 510 b leadframe attach high temp solder c termination cu d ni e sn f electrode ni g dielectric batio 3
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 3 3 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) insulation resistance limit table electrical characteristics z and esr c2220c476m3r2c z and esr c2220c225mar2c z and esr c1210c475m5r1c eia case size 1000 megohm microfarads or 100g 500 megohm microfarads or 10g 1210 < 0.39f 0.39f 1812 < 2.2f 2.2f 2220 < 10f 10f 10 0 10 2 10 4 10 6 10 8 10 10 frequency (hz) magnitude ohms c1210c475m5r1c z and esr frequency (hz) 10 -6 magnitude ohms 10 -4 10 0 10 2 10 4 10 6 10 -2 10 0 10 2 10 4 10 8 10 10 10 -3 10 -2 10 -1 esr 10 0 10 1 10 2 10 3 esr z 10 -3 10 -2 frequency (hz) magnitude ohms z 10 -1 10 0 10 1 10 2 10 3 10 4 esr z 10 0 10 2 10 4 10 6 10 8 10 10
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 4 4 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) 0.01 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 esr (ohms) frequency (hz) esr vs. frequency c1210c224k5r2c (2 chip stack) c1210c224k5r1c (1 chip stack) 0.01 0.1 1 10 100 1000 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 impedance (ohms) frequency (hz) impedance vs. frequency c1210c224k5r2c (2 chip stack) c1210c224k5r1c (1 chip stack) 0.01 0.1 1 10 100 1000 10000 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 impedance (ohms) frequency (hz) impedance vs. frequency c1812c104k5r2c (2 chip stack) c1812c104k5r1c (1 chip stack) 0.01 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 esr (ohms) frequency (hz) esr vs. frequency c1812c104k5r2c (2 chip stack) c1812c104k5r1c (1 chip stack) electrical characteristics con't impedance - 1210, .22 f, 50v x7r esr - 1210, .22 f, 50v x7r impedance - 1812, .10 f, 50v x7r esr - 1812, .10 f, 50v x7r
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 5 5 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) 0 20 40 60 80 100 120 0 10 20 30 absolute temperature (c) ripple current (arms) kemet kps, 2220, 22f, 50v rated (2 chip stack) competitor 2220, 22f, 50v rated (2 chip stack) 0 10 20 30 40 50 60 0 5 10 15 sound pressure (db) vp - p competitor kemet - kps 0 10 20 30 40 50 0 2 4 6 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 0 5 10 15 20 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 0 2 4 6 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 60 0 5 10 15 sound pressure (db) vp - p standard smd mlcc kps - 1 chip stack electrical characteristics con't competitive comparision ripple current (arms) 2220, 22 f, 50v microphonics - 1210, 4.7 f, 50v, x7r microphonics - 1210, 22 f, 25v, x7r microphonics - 2220, 47 f, 25v, x7r microphonics - 2220, 22 f, 50v, x7r microphonics - 1210, 4.7 f, 50v, x7r note: refer to table 4 for test method.
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 6 6 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) electrical characteristics con't 1 0 1 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1812 47uf 16v board flexture (mm) 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 2220 22uf 25v C (47uf kps stacked) board flexture (mm) standard termination kps C 2 chip stack board flexure to 10mm board flex vs. termination type board flexure to 10mm 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1210 4.7 uf 50v board flexture (mm) board flex vs. termination type 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1210 10 uf C (22uf kps stacked) board flexture (mm) standard termination kps C 2 chip stack
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 7 7 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) table 2 C chip thickness / packaging quantities package quantity based on finished chip thickness specifcations thickness code chip size thickness range (mm) qty per reel 7" plastic qty per reel 13" plastic fv 1210 3.35 0.10 600 2000 fw 1210 6.15 0.15 300 1000 gp 1812 2.65 0.35 500 2000 gr 1812 5.00 0.50 400 1700 js 2220 3.50 0.30 300 1300 jr 2220 5.00 0.50 200 800 table 1 C (1210 - 2220 case sizes) cap pf cap code series c1210 c1812 c2220 voltage code 8 4 3 5 1 a 4 3 5 1 a 4 3 5 1 a voltage 10 16 25 50 100 250 16 25 50 100 250 16 25 50 100 250 cap tolerance product availability and chip thickness codes - see table 2 for chip thickness dimensions single chip stack 0.10 uf 104 k m fv fv fv fv fv fv gp gp gp gp gp js js js js js 0.22 uf 224 k m fv fv fv fv fv gp gp gp gp gp js js js js js 0.47 uf 474 k m fv fv fv fv fv gp gp gp gp gp js js js js js 1.0 uf 105 k m fv fv fv fv fv gp gp gp gp js js js js js 2.2 uf 225 k m fv fv fv fv fv gp gp gp js js js js 3.3 uf 335 k m fv fv fv fv gp gp gp js js js js 4.7 uf 475 k m fv fv fv fv gp gp gp js js js 10 uf 106 k m fv fv fv gp gp js js js 15 uf 156 k m fv js js 22 uf 226 k m fv js js 33 uf 336 k m 47 uf 476 k m 100 uf 107 k m double chip stack 0.10 uf 104 m fw fw fw fw fw fw gr gr gr gr gr jr jr jr jr jr 0.22 uf 224 m fw fw fw fw fw fw gr gr gr gr gr jr jr jr jr jr 0.47 uf 474 m fw fw fw fw fw gr gr gr gr gr jr jr jr jr jr 1.0 uf 105 m fw fw fw fw fw gr gr gr gr gr jr jr jr jr jr 2.2 uf 225 m fw fw fw fw fw gr gr gr gr jr jr jr jr jr 3.3 uf 335 m fw fw fw fw gr gr gr gr jr jr jr jr 4.7 uf 475 m fw fw fw fw fw gr gr gr jr jr jr jr 10 uf 106 m fw fw fw fw gr gr gr jr jr jr 22 uf 226 m fw fw fw gr gr jr jr jr 33 uf 336 m fw jr jr 47 uf 476 m fw jr jr 100 uf 107 m 220 uf 227 m cap pf cap code voltage 10 16 25 50 100 250 16 25 50 100 250 16 25 50 100 250 voltage code 8 4 3 5 1 a 4 3 5 1 a 4 3 5 1 a series c1210 c1812 c2220
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 8 8 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) eia size code metric size code median (nominal) land protrusion (mm) x y c 1210 3225 1.75 1.14 3.00 1812 4532 2.87 1.35 4.39 2220 5650 4.78 2.08 5.38 stress reference test or inspection method ripple current heat generation ?t : 20oc max. refow solder the capacitor onto a pc board and apply voltage with 10khz~1mhz sine curve. (ripple voltage must be < rated voltage) terminal strength jis-c-6429 appendix 1, note:force of 1.8kg for 60 seconds. board flex jis-c-6429 appendix 2, note:2mm (min) for all except 3mm for c0g. solderability j-std-002 magnifcation 50x. conditions: a) method b, 4 hrs @ 155c, dry heat @ 235c b) method b @ 215c category 3 c) method d, category 3 @ 260c temperature cycling jesd22 method ja-104 1000 cycles (-55c to +125c), measurement at 24 hrs. +/- 2 hrs after test conclusion. biased humidity mil-std-202 method 103 load humidity: 1000 hours 85c/85%rh and rated voltage.add 100k ohm resistor. measurement at 24 hrs. +/- 2 hrs after test conclusion. low volt humidity:1000 hours 85c/85%rh and 1.5v.add 100k ohm resistor. measurement at 24 hrs. +/- 2 hrs after test conclusion. moisture resistance mil-std-202 method 106 t = 24 hours/cycle.steps 7a & 7b not required.unpowered. measurement at 24 hrs. +/- 2 hrs after test conclusion. thermal shock mil-std-202 method 107 -55c/+125c.note: number of cycles required-300, maximum transfer time-20 seconds, dwell time-15 minutes.air-air. high temperature life mil-std-202 method 108 1000 hours at 125c (85c for x5r, z5u and y5v) with 1.5x rated voltage applied. storage life mil-std-202 method 108 150c, 0vdc, for 1000 hours. mechanical shock mil-std-202 method 213 figure 1 of method 213, condition f. resistance to solvents mil-std-202 method 215 add aqueous wash chemical - okem clean or equivalent. soldering process recommended soldering technique: ? mounting technique is limited to solder refow only. recommended soldering profle ? kemet recommends following the guidelines outlined in ipc/jedec j-std-020d.1 table 3 C chip capacitor land pattern design recommendations per ipc-7351 table 4 C performance & reliability: test methods and conditions
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 9 9 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. table 5 - carrier tape confguration (mm) *refer to figure 1 for w and p 1 carrier tape reference locations. *refer to table 4 for tolerance specifcations. 8mm, 12mm or 16mm carrier tape 178mm (7.00") or 330mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static co v er t ape (.10mm (.004") max thic kness) chip and kps or ientation in po ck et (e xcept 1825 commercial, and 1825 & 2225 militar y) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes eia case size tape size (w)* pitch (p 1 )* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 kps 1210 12 8 kps 1812 & 2220 16 12 array 0508 & 0612 8 4
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 10 10 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) figure 1: embossed (plastic) carrier tape dimensions table 6 - embossed (plastic) carrier tape dimensions (metric will govern) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 5). 3. if s 1 <1.0 mm, there may not be enough area for cover tape to be properly applied (see eia document 481 paragraph 4.3 (b)). 4. b1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity defned by a 0 , b 0 and k 0 shall surround the component with suffcient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see figure 4) (e) for kps series product a 0 and b 0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see addendum in eia document 481 for standards relating to more precise taping requirements. constant dimensions millimeters (inches) tape size d 0 d 1 min. note 1 e 1 p 0 p 2 r ref. note 2 s 1 min. note 3 t max. t 1 max. 8mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 1.0 (0.039) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12mm 1.5 (0.059) 30 (1.181) 16mm variable dimensions millimeters (inches) tape size pitch b 1 max. note 4 e 2 min. f p 1 t 2 max w max a 0 ,b 0 & k 0 8mm single (4mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12mm single (4mm) & double (8mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16mm triple (12mm) 12.1 (0.476) 14.25 (0.561) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 16.3 (0.642) p o t f w c en t er li n e s of ca v i t y a o b o u s e r d i r e c t i o n o f u n r e elin g c ov er t ap e k o b 1 i s f or t ap e f e ed er r e f e r ence onl y, i ncl u di ng dr a ft con c en t r i c a bou t b o . t 2 ? d 1 ? d o b 1 s 1 t 1 e 1 e 2 p 1 p 2 e m b os s m e nt f or c a v i t y s i z e , s e e n o t e 1 t a b l e 6 [ 1 0 p i t c h e s c um u l at i v e t ol er a n c e o n t a p e 0. 2 m m ]
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 11 11 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) figure 2 C punched (paper) carrier tape dimensions table 7 - punched (paper) carrier tape dimensions (metric will govern) 1. the cavity defned by a 0 , b 0 and t shall surround the component with suffcient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia document 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 5). constant dimensions millimeters (inches) tape size d 0 e 1 p 0 p 2 t 1 max g min r ref. note 2 8mm 1.5 +0.10-0.0 (0.059 +0.004, -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (.004) max. 0.75 (.030) 25 (.984) variable dimensions millimeters (inches) tape size pitch e2 min f p 1 t max w max a 0 b 0 8mm half (2mm) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 1.1 (0.098) 8.3 (0.327) note 5 8mm single (4mm) 4.0 0.10 (0.157 0.004) 8.3 (0.327) u s e r d i r e c t ion of u n r ee li n g t o p c o v e r t ap e t c e n t e r l i nes o f c a v i t y p 1 ? d o p o p 2 e 1 f e 2 w g a 0 b 0 c a v i t y s i z e , s e e n ot e 1, tab l e 7 b o t t o m c o v e r t a p e t 1 t 1 b o t t o m c o v e r t a p e [ 10 p it c he s c u mu l a t i v e t o le r a n c e o n t a p e 0 . 2 m m]
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 12 12 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia-556 and eia-624. figure 3 C maximum component rotation figure 4 C maximum lateral movement figure 5 C bending radius 0 . 5 m m m a x i mu m 0 . 5 m m m a x i mu m 8 m m & 1 2 m m tap e 1 . 0 m m m a x i mu m 1 . 0 m m m a x i mu m 1 6 m m t a p e r r b en d i n g r a d i u s e mb o sse d c a r r i e r p un c he d c a rr ie r tape width peel strength 8mm 0.1 newton to 1.0 newton (10g to 100g) 12mm & 16mm 0.1 newton to 1.3 newton (10g to 130g) a o b o t s max i m u m c om pon e n t r o t a ti o n t op v i e w m a x i mum c o mponent r o t a t io n s id e v i e w t a p e m ax i m u m width (mm) r otat i o n ( t ) 8,12 2 0 16-200 1 0 t a p e m a x i m u m wid t h ( mm ) r o tat i o n ( s ) 8,12 20 16-56 1 0 72-200 5 t y p ic a l p o c k e t cente r lin e t y p i c a l c o m po n e n t c e n t e r l i n e
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 13 13 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) figure 6 C reel dimensions table 8 C reel dimensions (metric dimensions will govern) a d (see n o te ) f ull r a d i us , see n o t e b ( s ee note) access h o le at s l o t loc a ti on (? 40 m m mi n.) i f p r es en t, tape slot i n core f or t ap e st ar t: 2.5 mm min. wi dt h x 10.0 mm mi n . dep th w 3 (incl u des flan g e dis to r tion at out e r e dge) w 2 ( m ea s u re d a t hu b ) w 1 ( m ea s u re d a t hu b ) c (arbor hol e di a m e ter ) note: driv e spok es o ptiona l ; if u s ed, d i mensi o ns b an d d shall a pply. n constant dimensions millimeters (inches) tape size a b min c d min 8mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12mm 16mm variable dimensions millimeters (inches) tape size n min w 1 w 2 max w 3 8mm 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 14.4 (0.567) shall accommodate tape width without interference 12mm 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 18.4 (0.724) 16mm 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 22.4 (0.882)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 14 14 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) figure 7 C tape leader & trailer dimensions figure 8 C maximum camber t r a i le r 16 0 mm min i mum , c a r r i e r t ap e e n d s t a r t r o u nd s p ro ck e t h o l e s e l onga t ed s p r o ck e t h o l e s ( 32 mm t ape and w i de r ) t op c o ve r t ap e top c ove r t ap e p unche d c a r r i e r 8 mm & 12 m m o n l y e mbos s ed c a r r i e r c o m p o n e n t s 1 0 0 m m m i n . l e a d e r 4 0 0 mm m i n i m u m , c a r r i e r t a p e r o u n d s p r o c k e t h ol e s 1 m m ma x i m u m , e i t h e r d i r e c t i o n s t r ai gh t edge 2 5 0 m m e l o n g a t ed s p r oc k e t h ol e s ( 32 m m & w ide r t a pe s )
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 15 15 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) other kemet resources tools resource location confgure a part: capedge http://capacitoredge.kemet.com spice & fit software http://www.kemet.com/spice search our faqs: knowledgeedge http://www.kemet.com/keask product information resource location products http://www.kemet.com/products technical resources (including soldering techniques) http://www.kemet.com/technicalpapers rohs statement http://www.kemet.com/rohs quality documents http://www.kemet.com/qualitydocuments product request resource location sample request http://www.kemet.com/sample engineering kit request http://www.kemet.com/kits contact resource location website www.kemet.com contact us http://www.kemet.com/contact investor relations http://www.kemet.com/ir call us 1-877-mykemet twitter http://twitter.com/kemetcapacitors
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1020-4 ? 6/22/2010 16 16 surface mount multilayer ceramic chip capacitors Ckps series C commercial grade (x7r dielectric) kemet corporation world headquarters p.o. box 5928 greenville, sc 29606 www.kemet.com tel: 864-963-6300 fax: 864-963-6521 north america corporate offces 101 ne third avenue tower 101, suite 1700 fort lauderdale, fl 33301 tel: 954-766-2800 fax: 954-766-2805 southeast 801 international parkway, suite 500 lake mary, fl 32746 tel: 407-855-8886 northeast 340-x fordham road wilmington, ma 01887 phone: 978-658-1663 fax: 978-658-1790 central 1900 north roselle road, suite 405 schaumburg, il 60195 tel: 847-882-3590 fax: 847-882-3046 west 1551 mccarthy boulevard, suite 117 milpitas, ca 95035 tel: 408-433-9946 fax: 408-433-9946 mexico tezozomoc no. 47 col. ciudad del sol zapopan, jalisco c.p. 45050 mexico tel: 52-33-3123-2141 fax: 52-33-3123-2144 europe southern europe 15bis chemin des mines 1202 geneva switzerland tel: 41-22-715-0100 fax: 41-22-715-0170 zac paris rive gauche 118-122 avenue de france 75013 paris, france tel: 33-1-4646-1009 fax: 33-1-4646-1599 via san lorenzo 19 sasso marconi, bo 40037 italy tel: 39-051-939111 fax: 39-051-840684 via milanofori palazzo a/2 scala 2 milano 20090 italy tel: 39-02-57518176 fax: 39-02-57512093 central europe hermann-koehl-str. 2 landsberg am lech 86899 germany tel: 49-8191-3350800 fax: 49-8191-3350990 ruhrallee 9 dortmund 44139 germany tel: 49-2307-3619672 fax: 49-2307-961527 northern europe unit 1, ducketts wharf south street bishops stortford hertfordshire cm23 3al united kingdom phone: 44-1279-757201 fax: 44-1279-465237 20 cumberland drive granby industrial estate weymouth, dorset dt4 9te united kingdom tel: 44-1305-830747 fax: 44-1305-760670 th?rnblads v?g 6 f?rjestaden 386 90 sweden tel: 46-485-563934 fax: 46-485-563938 stella business park lars sonckin kaari 16 espoo 02600, finland tel: 358-9-5406-5000 fax: 358-9-5406-5010 asia northeast asia 30 canton road, room 1512 silvercord tower ii tsimshatshui, kowloon, hong kong tel: 852-2305-1168 fax: 852-2759-0345 room 1411, 14/f new china insurance edifce mintian road, cbd futian district shenzhen 518001, china tel: 1-867-55-25181306 fax: 1-867-55-25181307 floor 17, tower b, ping an ifc no.1-3 xin yuan south road chao yang district beijing 100027, china tel: 86-10-5829-1711 fax: 86-10-5829-1963 room 2602, grand gateway tower 1 no.1 hong qiao road shanghai 200030, china tel: 86-21-6447-0707 fax: 86-21-6447-0070 room 305, floor 3, #142 sec. 4, chung hsiao east road taipei 106, taiwan roc tel: 886-2-27528585 fax: 886-2-27213129 southeast asia 73 bukit timah road #05-01 rex house 229832 singapore tel: 65-6586-1900 fax: 65-6586-1901 1-5-20 krystal point 2 lebuh bukit kecil 6 11900 bayan baru penang, malaysia tel: 6- 04-6430200 fax: 6 -04-6444220 offce no. 605, 6th floor barton centre m.g. road bangalore 560 001 india tel: 91-80-653-76817 fax: 91-80-2532-0160 note: kemet reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. kemet does not assume any responsibility for infringement that might result from the use of kemet capacitors in potential circuit designs. kemet is a registered trademark of kemet electronics corporation.

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